Packaging Central

Packaging Central

Packaging Highlights​ 

Fan-Outs Vs. TSVs (Semiconductor Engineering; Dec. 13, 2017)

Advanced Packaging Is Suddenly Very Cool (Semiconductor Engineering; Dec. 11, 2017)

Shortages Hit Packaging Biz (Semiconductor Engineering; Dec. 11, 2017)

A Tribute to Gilles Poupon, CEA-Leti’s Advanced Packaging Pope (3DInCites; Nov. 30, 2017)

ASE to Enlarge High-End Packaging Plant in Kaohsiung (China Times; Nov 28, 2017)

Five Trends in IC Packaging (SemiEngineering; Nov 17, 2017)

IBM: Copper Interconnects Here to Stay (EE Times; Nov 15, 2017)

Industry Conference in Southeast Asia (Solid State Technology; Nov 15, 2017)

Samsung Shows EUV Design at ISSCC: Advances shown across memories, processors, sensors (EE Times; Nov 13, 2017)

What's Missing in Packaging? (SemiEngineering; Nov 13, 2017)

Litho Options For Panel Fan-Out (SemiEngineering; Nov 6, 2017)

Challenges And Improvement Of Reliability In Advanced Wafer Level Packaging Technology (SemiEngineering; Nov 6, 2017)

The Memory Packaging Market Shows Steady Growth (3DIncites; Nov 3, 2017)

MEMS Packaging Market is Growing Faster Than The MEMS Devices Market (3DIncites; Nov 2, 2017)

Panel Level Packaging: The Next Sleeping Giant? And Other Thoughts From IWLPC 2017 (3DInCites; Oct 27, 2017)

SEMICON Taiwan Part 2: Laser Processing  (Solid State Technology; Oct 23, 2017)

SEMI WEBINAR (Oct 25): Heterogeneous Integration Driving New Applications: Spotlight on 3D Integration, Packaging and Automotive

China IC Industry Outlook (SEMI/SST; Oct 17, 2017)

SEMICON Taiwan Part 1: Fan-out Packaging Players, Applications and Market Growth (Solid State Technolgy; Oct 2017)

Wafer Shipments Forecast to Increase in 2017, 2018 and 2019 (SEMI; Oct 16, 2017)

The Chiplet Option (SemiEngin; Oct 9, 2017)

Integrated Passives Market Gets Active (SemiEngin; Oct 9, 2017)

Advanced Packaging’s Progress (SemiEngin; Oct  9, 2017)

New 3D packaging & integration committee (SST; Oct 2, 2017)

Robotics and chip industries in Japan (SST; Oct 2, 2017)

Packaging Articles: Archives

Purchase: Global Semiconductor Packaging Materials Outlook — 2015-2019


Upcoming Events

Dec 13-15SEMICON Japan 2017
Jan 31-Feb 2SEMICON Korea 2018
Mar 14-16SEMICON China 2018
Apr 30-May 3Advanced Semiconductor Manufacturing Conference 2018
May 8-10SEMICON Southeast Asia 2018
July 10-12SEMICON West 2018
More Events 

New from SEMI: Packaging Report

Purchase the Global Semiconductor Packaging Materials Outlook — 2015-2019

Packaging Backgrounder

 Advanced Packaging Market Data from Yole Développement (January 2017)



SEMI provides both the forum and leadership so companies can confidently participate in an open, informed and professional environment on packaging issues.

Packaging activities are integrated with other SEMI programs, events, products, and initiatives. 


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