Packaging Central

Packaging Central

Packaging Highlights​ 

Cheaper Fan-Outs Ahead (SemiEngin; Aug 7, 2017)

Packaging Enters New Phase (SemiEngin; Aug 7, 2017)

Advanced Packaging Moves To Cars (SemiEngin; Aug 7, 2017)

Kuala Lumpur Debut for SEMICON Southeast Asia in 2018 (Aug 1, 2017)

AMD’s CTO on 7nm, Chip Stacks (EE Times; July 24, 2017)

Heterogeneous Integration Versus Dimensional Scaling; One Year In (Part 2) (3DInCites; July 24, 2017)

SEMICON West 2017: The Semiconductor Industry at a Young 50 (3DInCites; July 26, 2017)

Heterogeneous Integration Versus Dimensional Scaling: One Year In (Part 1) (3DInCites; July 19, 2017)

Re-Using IP In Packaging (SemiEngin; July 10)

Advanced Packaging Picks Up Steam (SemiEngin; July 10)

28nm Chip-Package Interactions In Large EWLB FO-WLP (SemiEngin; July 10)

Challenges For Future Fan-Outs  (SemiEngin; July 7)

Warpage Issues in Fan-Out Wafer Level Packaging (3DInCites; June 26, 2017)

Tech Session Highlights from ECTC 2017 (3DInCites; June 26, 2017)

Forging a Bright Future for IC and Package Quality (EE Times, June 19, 2017)

Shrink Or Package? (SemiEngin, June 19, 2017)

IFTLE 339 Will 450mm Equipment Keep Si the Fine Feature WLCSP Solution? (SST SMD Community, June 14, 2017)

Packaging Articles: Archives

 

Purchase: Global Semiconductor Packaging Materials Outlook — 2015-2019

      

Upcoming Events

Sept 13-15SEMICON Taiwan 2017
Nov 14-17SEMICON Europa 2017
Dec 13-15SEMICON Japan 2017
Jan 31-Feb 2SEMICON Korea 2018
Mar 14-16SEMICON China 2018
More Events 

New from SEMI: Packaging Report

Purchase the Global Semiconductor Packaging Materials Outlook — 2015-2019

Packaging Backgrounder

 Advanced Packaging Market Data from Yole Développement (January 2017)

 

Packaging

SEMI provides both the forum and leadership so companies can confidently participate in an open, informed and professional environment on packaging issues.

Packaging activities are integrated with other SEMI programs, events, products, and initiatives. 

 

Get Involved