Packaging Central

Packaging Central

Packaging Highlights  

More 2.5D/3D, Fan-Out Packages Ahead (Semiconductor Engineering; Jan 15, 2019)

Reducing Advanced Packaging Costs (Semiconductor Engineering; Jan 9, 2019)

IFTLE 401: FOWLP for RF; D2W Hybrid Bonding; FOPLP in Samsung Watch (3D InCites; Jan 3, 2019)

Highlights From MEPTEC’s 2018 Heterogeneous Integration Symposium (3D InCites; Jan 2, 2019)

What’s The Right Path For Scaling? (Semiconductor Engineering; Jan 2, 2019)

Implementing High-Density Advanced Packaging for OSATs and Foundries (3D InCites; Dec 17, 2019)

IFTLE 400: Intel Logic-Logic 3DIC and Chiplets are Finally Here (3D InCites; Dec 14, 2019)

China leadframe supply chain not gaining ground, says Chang Wah chairman (DigiTimes; Dec 10, 2018)

Packaging Biz Faces Challenges In 2019 (Semiconductor Engineering; Dec 10, 2018)

Where Advanced Packaging Makes Sense (Semiconductor Engineering; Dec 10, 2018)

The Benefits of Smart Packaging (Printed Electronics Now; Nov 21, 2018)

Designing and Integrating MCM/SIP Packages into Systems PCBs (3D InCites; Nov 20, 2018) 

UnitySC Unveils New Inspection System for the Advanced Packaging and Wafer Processing Ecosystem (3D InCites; Nov 13, 2018)

Design For Advanced Packaging (Semiconductor Engineering; Nov 8, 2018)

Panel Fan-Out Ramps, Challenges Remain (Semiconductor Engineering; Nov 5, 2018)

IFTLE 397: Malicious Embedded Chips? And TSMC Rides the Leading Edge (3D InCites; Oct 30, 2018)

Overcoming Challenges for Smart Packaging (Printed Electronics Now; Oct 24, 2018) 

Advanced Packaging Technologies Key for Semiconductor Innovation (ElectroIQ; Oct 24, 2018)

Hello, Microelectronics and Packaging? Your Opportunities are Calling (3D InCites; Oct 16, 2018)

Silicon Carbide: Driving Package Innovation (Compound Semiconductor; Oct 8, 2018)

Defect Challenges Growing In Advanced Packaging (Semiconductor Engineering; Oct 8, 2018)

IC packagers warming up to 5G opportunities (Digitimes; Oct 3, 2018)

Smart Packaging: Printed Electronics as Growth Driver (Printed Electronics Now; Oct 2, 2018)

Path to Systems: Opportunities and Challenges for Next-Gen Semiconductor Integration (Electronic Design; Sept 14, 2018)

Why Today’s Advanced Packages Need Better Inspection and What’s Being Done About It (3D InCites; Sept 13, 2018)

The Race To Zero Defects (Semiconductor Engineering; Sept 10, 2018)

Sorting Out Packaging Options (Semiconductor Engineering; Sept 10, 2018)

11 Myths About SiP (Electronic Design; Sept 5, 2018)

A Long Journey Calls for a Map (EE Times; Aug 24, 2018)

Old Vs. New Packages (Semiconductor Engineering; Aug 15, 2018)

Return Of The Organic Interposer (Semiconductor Engineering; Aug 6, 2018)

TechSearch International Analyzes Trends in Packages for AI Applications (3D InCites; Aug 2, 2018)

Bridges Vs. Interposers (Semiconductor Engineering; July 12, 2018) 

3D Semiconductor Packaging Market to See Incredible Growth During 2025 (Energy News: July 10, 2018)

Optimized stepping for fan-out wafer and panel packaging (Solid State Technology; July 9, 2018)

Material innovations for advancements in fan-out packaging (Solid State Technology; July 9, 2018)

Transforming the Fan-out Landscape (3DInCites; June 26, 2018)

TSMC dominance in 7nm process enhanced with InFO package (DigiTimes; June 25, 2018)

Advanced Packaging Confusion (Semiconductor Engineering; June 13, 2018)

Extending The IC Roadmap (Semiconductor Engineering; June 11, 2018)

New Transistor Types Vs. Packaging (Semiconductor Engineering; June 11, 2018)

ECTC 2018 Paves the Path to Heterogeneous Integration (3DInCites; June 5, 2018)

The Advanced Packaging Industry is on the Move (3DInCites; June 1, 2018)

Shower Heads Installed in Packaging Could Keep Chips Cool (Electronic Design; May 29, 2018)

Packaging Materials (Solid State Technology; May 21, 2018)

OSAT Consolidation Continues (Semiconductor Engineering; May 14, 2018)

Thermal Metamaterials for Advanced Packaging Applications from Stanford University (3DInCites; May 11, 2018)

Early Chip-Package-System Thermal Analysis (Semiconductor Engineering; May 10, 2018)

UnitySC Opens New Asia Entity to Support Advanced Packaging and Power Device Markets (3DInCites; May 8, 2018)

Packaging Chips For Cars (Semiconductor Engineering; May 7, 2018)

MIS Packaging Takes Off (Semiconductor Engineering; May 7, 2018)

Packaging Articles: Archives

Purchase: Global Semiconductor Packaging Materials Outlook — 2015-2019


Upcoming Events

Jan 8-11SEMI Smart Starts Here Pavilion @ CES 2019
Jan 28-30SEMI 3D & Systems Summit
Feb 18-21FLEX 2019
Feb 19-20MSTC 2019

Mar 20-22


Mar 31-Apr 2ISS Europe
More Events 

New from SEMI: Packaging Report

Purchase the Global Semiconductor Packaging Materials Outlook — 2015-2019

Packaging Backgrounder

 Advanced Packaging Market Data from Yole Développement (January 2017)



SEMI provides both the forum and leadership so companies can confidently participate in an open, informed and professional environment on packaging issues.

Packaging activities are integrated with other SEMI programs, events, products, and initiatives. 


Get Involved