Industry News Archive Provided by SEMI

Industry News Archive

SEMI provides this archive of news and information from industry news sources as a resource. Due to the nature of dated material on the internet, SEMI does not guarantee that links are maintained by the news provider.

Industry enters the age of WOW
(Solid State Technology - 13 Dec 2017)

4Q DRAM sales put exclamation point on an amazing year of growth
(Solid State Technology - 13 Dec 2017)

Accelerating the self-assembly of nanoscale patterns for next-generation materials
(Nanowerk - 13 Dec 2017)

IoT Markets to Watch in 2018
(Electronic Engineering Times - 13 Dec 2017)

Is Big Data for IC Design Too Big to Manage?
(Electronic Engineering Times - 13 Dec 2017)

The Implementation Of Embedded PVT Monitoring Subsystems In Today’s Cutting Edge Technologies
(Semiconductor Engineering - 13 Dec 2017)

Chip Boom Masks Weakness in Korea’s Booming Economy
(Bloomberg - 12 Dec 2017)

New silicon structure opens the gate to quantum computers
(Solid State Technology - Blog - 12 Dec 2017)

EVG installs low-temperature plasma activation system at University of Tokyo for III-V on silicon wafer bonding
(Semiconductor Today - 12 Dec 2017)

$55.9B semiconductor equipment forecast: New record with Korea at top
(Solid State Technology - 12 Dec 2017)

Researchers make solid ground toward better lithium-ion battery interfaces
(Phys.org - 12 Dec 2017)

System Bits: Dec. 12
(Semiconductor Engineering - 12 Dec 2017)

Redpine Flexes 'Lowest-Power' Wireless MCU
(Electronic Engineering Times - 12 Dec 2017)

The Sonic Internet
(New Electronics - 12 Dec 2017)

Manufacturing Bits: Dec. 12
(Semiconductor Engineering - 12 Dec 2017)

IC designers to embrace lucrative smart speaker market in 2018
(Digitimes - 12 Dec 2017)

Disco’s KABRA!zen fully automates KABRA laser slicing technology
(Semiconductor Today - 11 Dec 2017)

Fins boost prototype vertical GaN transistor to 1200V, sufficient for electric vehicles
(Semiconductor Today - 11 Dec 2017)

That Was The Year That Was In Test
(Semiconductor Engineering - 11 Dec 2017)

At The Intersection Of Electronics And Automobiles
(Semiconductor Engineering - 11 Dec 2017)

New Carbon Nanotube Sheets Claim World’s Top Heat-Sink Performance
(IEEE Spectrum - 07 Dec 2017)

The IoT Is Alive And Well
(Semiconductor Engineering - 07 Dec 2017)

How to tame the electromagnetic interference in the fabs and beyond
(Solid State Technology - Blog - 07 Dec 2017)

The future of hardware is AI
(Phys.org - 07 Dec 2017)

IoT’s Many Different Forms
(Semiconductor Engineering - 07 Dec 2017)

Hyperscaling The Data Center
(Semiconductor Engineering - 07 Dec 2017)

Automotive Opps Drive Change For Systems Companies
(Semiconductor Engineering - 07 Dec 2017)

Big Challenges, Changes For Debug
(Semiconductor Engineering - 04 Dec 2017)

5 boards that will kick-start your IoT project
(Electronic Engineering Times - 04 Dec 2017)

Fujitsu Labs develops pure carbon-nanotube sheets
(Electronic Products & Technology - 03 Dec 2017)

Soitec's new Imager-SOI substrates enable silicon-based image sensors to increase performance in near-infrared spectrum
(Display Plus - 03 Dec 2017)

STMicroelectronics collaborates with Amazon Web Services on complete STM32-based IoT node-to-cloud solution for Amazon FreeRTOS (Display Plus - 02 Dec 2017)

Women in Power
(Unknown - 02 Dec 2017)

‘Magnetoelectric’ material shows promise as memory for electronics
(Solid State Technology - 01 Dec 2017)

'Origami' lattices with nano-scale surface ornaments
(Phys.org - 01 Dec 2017)

Chinese wafer foundry chooses SPTS equipment for new line
(Evertiq - 01 Dec 2017)

The Week In Review: Manufacturing
(Semiconductor Engineering - 01 Dec 2017)

When Less is Moore
(Electronic Engineering Times - 01 Dec 2017)

Researchers advance nanotechnology technique to detect ovarian cancer
(Nanowerk - 30 Nov 2017)

Apple may make its own iPhone power management chips in 2018
(CNET News - 30 Nov 2017)

Discovery points the way to better and cheaper transparent conductors
(Solid State Technology - Blog - 30 Nov 2017)

How To Use CFD To Test And Analyze A Chip Package
(Semiconductor Engineering - 30 Nov 2017)

Could Liquid IP Lead To Better Chips?
(Semiconductor Engineering - 30 Nov 2017)

4 Strange New Ways to Compute
(IEEE Spectrum - 29 Nov 2017)

Changelight orders further Aixtron AIX 2800G4-TM MOCVD systems to expand ROY LED capacity
(Semiconductor Today - 29 Nov 2017)

Development kits have a crucial role to play in stimulating the UK’s compound semiconductor supply chain
(New Electronics - 29 Nov 2017)

U.S. Angles to Retake Supercomputer Lead
(Electronic Engineering Times - 29 Nov 2017)

Big Challenges, Changes For Debug
(Semiconductor Engineering - 04 Dec 2017)

5 boards that will kick-start your IoT project
(Electronic Engineering Times - 04 Dec 2017)

Fujitsu Labs develops pure carbon-nanotube sheets
(Electronic Products & Technology - 03 Dec 2017)

Soitec's new Imager-SOI substrates enable silicon-based image sensors to increase performance in near-infrared spectrum
(Display Plus - 03 Dec 2017)

STMicroelectronics collaborates with Amazon Web Services on complete STM32-based IoT node-to-cloud solution for Amazon FreeRTOS (Display Plus - 02 Dec 2017)

Women in Power
(Unknown - 02 Dec 2017)

‘Magnetoelectric’ material shows promise as memory for electronics
(Solid State Technology - 01 Dec 2017)

'Origami' lattices with nano-scale surface ornaments
(Phys.org - 01 Dec 2017)

Chinese wafer foundry chooses SPTS equipment for new line
(Evertiq - 01 Dec 2017)

The Week In Review: Manufacturing
(Semiconductor Engineering - 01 Dec 2017)

When Less is Moore
(Electronic Engineering Times - 01 Dec 2017)

Researchers advance nanotechnology technique to detect ovarian cancer
(Nanowerk - 30 Nov 2017)

Apple may make its own iPhone power management chips in 2018
(CNET News - 30 Nov 2017)

Discovery points the way to better and cheaper transparent conductors
(Solid State Technology - Blog - 30 Nov 2017)

How To Use CFD To Test And Analyze A Chip Package
(Semiconductor Engineering - 30 Nov 2017)

Could Liquid IP Lead To Better Chips?
(Semiconductor Engineering - 30 Nov 2017)

4 Strange New Ways to Compute
(IEEE Spectrum - 29 Nov 2017)

Changelight orders further Aixtron AIX 2800G4-TM MOCVD systems to expand ROY LED capacity
(Semiconductor Today - 29 Nov 2017)

Development kits have a crucial role to play in stimulating the UK’s compound semiconductor supply chain
(New Electronics - 29 Nov 2017)

U.S. Angles to Retake Supercomputer Lead
(Electronic Engineering Times - 29 Nov 2017)

The New Road Warriors
(Semiconductor Engineering - 27 Nov 2017)

ASE-SPIL Gain Merger Clearance
(Semiconductor Engineering - 25 Nov 2017)

What AlphaGo Zero Means for the Future of AI
(Electronic Engineering Times - 22 Nov 2017)

Time to Look For Low-Cost DRAM Alternatives
(EE Times Blogs - 22 Nov 2017)

MEMS Design Shrinks Speakers to Chip Scale
(Electronic Engineering Times - 22 Nov 2017)

Manufacturing Bits: Nov. 21
(Semiconductor Engineering - 21 Nov 2017)

Women in Tech: 25 Profiles in Persistence
(Electronic Engineering Times - 20 Nov 2017)

Automotive Foundries
(Semiconductor Engineering - 16 Nov 2017)

Chips In China
(Semiconductor Engineering - 16 Nov 2017)

What’s What In Advanced Packaging
(Semiconductor Engineering - 16 Nov 2017)

Five Trends In IC Packaging
(Semiconductor Engineering - 16 Nov 2017)

Top Takeaways From SEMI-MSIG MEMS & Sensors Executive Congress 2017
(Semiconductor Engineering - 16 Nov 2017)

China Passes U.S. in Supercomputers
(Electronic Engineering Times - 13 Nov 2017)

Augmented Reality and Virtual Reality Market: Flourishing Smartphone Industry and Entry of AR and VR in Gaming to Propel Market
(TMCnet.com - 10 Nov 2017)

Chip Incubator Warms New Startups
(Electronic Engineering Times - 10 Nov 2017)

Could printed electronics help plants to talk to us?
(New Electronics - 09 Nov 2017)

iPhone X Costs Apple $370 in Materials, IHS Markit Teardown Reveals
(Press Release Point - 08 Nov 2017)

Analog Devices' Industrial Inertial Measurement Units Improve Navigation and Reliability in Autonomous Machines
(TMCnet.com - 08 Nov 2017)

New approach uses light instead of robots to assemble electronic components
(Phys.org - 07 Nov 2017)

TUBALL nanotube-based concentrates recognised as the most innovative raw material for composites by JEC Group
(Nanotechnology Now - 07 Nov 2017)

2017 ITC Wrap-up
(Semiconductor Engineering - 06 Nov 2017)

Let’s Be Smart About Artificial Intelligence
(Semiconductor Engineering - 06 Nov 2017)

Challenges And Improvement Of Reliability In Advanced Wafer Level Packaging Technology
(Semiconductor Engineering - 06 Nov 2017)

Where MEMS Can Boldly Go Now
(Semiconductor Engineering - 06 Nov 2017)

MEMS & sensors safeguard autonomous cars, boost agricultural productivity and anticipate needs
(Solid State Technology - Blog - 03 Nov 2017)

Veeco, Allos co-develop MOCVD for micro LED wafers
(Digitimes - 03 Nov 2017)

Opto, sensor and discrete ICs to reach record US$75 billion in 2017, says IC Insights
(Digitimes - 03 Nov 2017)

Opening the Van der Waals’ sandwich
(Solid State Technology - Blog - 02 Nov 2017)

Medical IoT Heats Up
(Semiconductor Engineering - 02 Nov 2017)

Big Trucks Go Electric, Autonomous
(Semiconductor Engineering - 02 Nov 2017)

Global Pressure Sensor Dies Market - Analysis, Technologies & Forecasts to 2021 - Research and Markets
(TMCnet.com - 02 Nov 2017)

Faster Commoditization In Cars
(Semiconductor Engineering - 02 Nov 2017)

Lead In Water: 11-Year-Old Girl Creates Portable Detection Device, Wins Award
(International Business Times - 02 Nov 2017)

MediaTek Shifts To IoT
(Electronic Engineering Times - 01 Nov 2017)

Samsung and Softbank invests in Israeli LiDAR company
(Evertiq - 01 Nov 2017)

Amorphous metallic glass for high-sensitivity MEMS microphones
(Phys.org - 01 Nov 2017)

Manufacturing Bits: Oct. 31
(Semiconductor Engineering - 31 Oct 2017)

SEMI FlexTech selects PARC to build ultrathin, flexible audio speaker
(Solid State Technology - Blog - 30 Oct 2017)

The MEMS packaging market is growing faster than the devices market itself
(Solid State Technology - 30 Oct 2017)

First Ultrasound-on-a-Chip receives broadest FDA 510(k) clearance
(SYS-CON INDIA - 27 Oct 2017)

Intel Lifts Sales Forecast After Strong Q3
(Electronic Engineering Times - 26 Oct 2017)

Wearable Sensors Markets 2018-2028: Technologies & Players - Commoditisation, Shakeout, Maturity
(SYS-CON INDIA - 26 Oct 2017)

Tiny chip-based methane spectrometer could help reduce greenhouse gas emissions
(Solid State Technology - 26 Oct 2017)

Si-Ware Awarded SEMI European MEMS and Sensor Award
(Photonics.com - 26 Oct 2017)

Look Ma, No Hands! Functional Safety From The Driver’s Seat
(Semiconductor Engineering - 26 Oct 2017)

STMicroelectronics announces class-leading water-resistant pressure sensor and first design win in high-performance wearables from Samsung
(Display Plus - 26 Oct 2017)

Global Automotive MEMS Sensors Market: 2017-2021 - Research and Markets
(SYS-CON INDIA - 25 Oct 2017)

Wafer-level packaging device shipments to overtake flip chip tech in 2018
(Solid State Technology - Blog - 24 Oct 2017)

How To Manage Semiconductor Tool Obsolescence
(Silicon Semiconductor - 24 Oct 2017)

Global ADAS and Autonomous Driving Components Market 2017-2026 - Growing Demand for LiDAR Sensors & Rapidly Increasing Number of Automated Vehicles(PR Newswire (EN) - 24 Oct 2017)

U.S. Can't Pull Down China's Data Wall
(Electronic Engineering Times - 24 Oct 2017)

Manufacturing Bits: Oct. 24
(Semiconductor Engineering - 24 Oct 2017)

System Bits: Oct. 24
(Semiconductor Engineering - 24 Oct 2017)

Brexit, Britain, and Beijing
(Electronic Engineering Times - 24 Oct 2017)

Applying pressure - MEMs in the medical industry
(New Electronics - 24 Oct 2017)

Nanotube fiber antennas as capable as copper
(Press Release Point - 23 Oct 2017)

Pressure Sensor Market Worth 11.30 Billion USD by 2023
(TMCnet.com - 23 Oct 2017)

IC makers maximize 300mm, 200mm wafer capacity, says IC Insights
(Digitimes - 20 Oct 2017)

IC makers maximize 300mm, 200mm wafer capacity, says IC Insights
(Digitimes - 20 Oct 2017)

The Week In Review: Manufacturing
(Semiconductor Engineering - 20 Oct 2017)

TSMC Expects 10nm Demand to Soar
(Electronic Engineering Times - 20 Oct 2017)

The Great Skills Race
(Semiconductor Engineering - 19 Oct 2017)

What’s Up With MEMS?
(Semiconductor Engineering - 19 Oct 2017)

Exploring New Scaling Approaches
(Semiconductor Engineering - 19 Oct 2017)

MEMS Market Shifting
(Semiconductor Engineering - 19 Oct 2017)

Wafer Shipments Forecast to Rise Through 2019
(Electronic Engineering Times - 19 Oct 2017)

This nanoelectronics breakthrough could lead to more efficient quantum devices
(Phys.org - 18 Oct 2017)

How To Build An IoT Chip
(Semiconductor Engineering - 18 Oct 2017)

New Materials For Computing
(Semiconductor Engineering - 12 Oct 2017)

Will IoT Sensors Lead to Test Headaches?
(EE Times Blogs - 12 Oct 2017)

GLOBALFOUNDRIES introduces new automotive platform to fuel tomorrow’s connected car
(Solid State Technology - 12 Oct 2017)

Globalfoundries Speaks Car Talk
(Electronic Engineering Times - 12 Oct 2017)

Noise Abatement
(Semiconductor Engineering - 12 Oct 2017)

A foldable iPhone may be in the works for 2020
(CNET News - 11 Oct 2017)

Intel Says New Chip Shows Rapid Progress in Quantum Computing
(Bloomberg - 10 Oct 2017)

Semiconductor Tool Market Continues Descent
(Electronic Engineering Times - 10 Oct 2017)

Manufacturing Bits: Oct. 10
(Semiconductor Engineering - 10 Oct 2017)

Intel May Sit Out Race to EUV
(Electronic Engineering Times - 10 Oct 2017)

Report: TSMC's 3nm Fab Could Cost $20 Billion
(Electronic Engineering Times - 09 Oct 2017)

Advanced Packaging’s Progress
(Semiconductor Engineering - 09 Oct 2017)

Gartner identifies the top 10 strategic technology trends for 2018
(Solid State Technology - Blog - 06 Oct 2017)

Order From Chaos: When the Entrepreneur Leaves
(EE Times Blogs - 06 Oct 2017)

MEMS & sensors companies compete for tech showcase “crown”
(Solid State Technology - Blog - 05 Oct 2017)

Pure-play foundries boosting their presence in China
(Solid State Technology - 05 Oct 2017)

Get Ready For The Uber-Like Economy
(Semiconductor Engineering - 05 Oct 2017)

Unprecedented Opportunities in Automotive Electronics Register Now for FUTURECAR
(Press Release Point - 05 Oct 2017)

Testing Autonomous Vehicles
(Semiconductor Engineering - 05 Oct 2017)

Let’s Talk About Securing The Industrial Internet of Things
(Semiconductor Engineering - 05 Oct 2017)

Head of Taiwan microchip giant TSMC set to retire
(Phys.org - 02 Oct 2017)

Getting A Standard Right The First Time
(Semiconductor Engineering - 02 Oct 2017)

Prototypes Proliferate
(Semiconductor Engineering - 02 Oct 2017)

Die Handling Critical in Flex Electronics
(EE Times Blogs - 29 Sep 2017)

Prototyping Building Blocks
(Semiconductor Engineering - 28 Sep 2017)

Verification’s Breaking Points
(Semiconductor Engineering - 28 Sep 2017)

Does Japan Get IIoT?
(Electronic Engineering Times - 28 Sep 2017)

Wearable sensors reach their first billion-dollar year, with growth coming in three waves
(Solid State Technology - 27 Sep 2017)

Plugging Gaps In Advanced Packaging
(Semiconductor Engineering - 27 Sep 2017)

Graphene forged into three-dimensional shapes
(Solid State Technology - Blog - 26 Sep 2017)

Manufacturing Bits: Sept. 26
(Semiconductor Engineering - 26 Sep 2017)

Nvidia CEO in China: Big Push for AI Inference
(Electronic Engineering Times - 26 Sep 2017)

Looming Issues And Tradeoffs For EUV
(Semiconductor Engineering - 25 Sep 2017)

DSA and EUV: Complementary technologies to enable fine- pitch lithography
(Solid State Technology - Blog - 22 Sep 2017)

Digital Health Market Expected to Reach US$ 536.6 Bn Globally by 2025
(Computerworld Australia - 22 Sep 2017)

AI Technology Is Changing Voice Recognition
(Semiconductor Engineering - 22 Sep 2017)

Globalfoundries Reportedly Asks EU to Probe TSMC
(Electronic Engineering Times - 22 Sep 2017)

SEMICON Europa Moves to Munich: Empowering Innovation and Shaping the Value Chain
(Press Release Point - 21 Sep 2017)

Application of air-sensitive semiconductors in nanoelectronics
(Solid State Technology - 21 Sep 2017)

7 Views of Globalfoundries in 2017
(Electronic Engineering Times - 21 Sep 2017)

The Materials Gap
(Semiconductor Engineering - 21 Sep 2017)

GLOBALFOUNDRIES and Soitec enter into long-term supply agreement on FD-SOI wafers
(Solid State Technology - 19 Sep 2017)

Samsung Electronics joins Semiconductor Research Corporation on research consortium
(Solid State Technology - 19 Sep 2017)

The U.S., China and the Chip Industry
(EE Times Blogs - 19 Sep 2017)

New technique promises tunable laser devices
(Phys.org - 19 Sep 2017)

Manufacturing Bits: Sept. 19
(Semiconductor Engineering - 19 Sep 2017)

A solar cell you can put in the wash
(ScienceDaily - 18 Sep 2017)

Lam Research announces 2017 Supplier Excellence Award recipients
(Solid State Technology - 16 Sep 2017)

AI Reshaping Fab Operations
(Electronic Engineering Times - 15 Sep 2017)

The Week In Review: Manufacturing
(Semiconductor Engineering - 15 Sep 2017)

DARPA CHIPS Program Pushes For Chiplets
(Semiconductor Engineering - 14 Sep 2017)

What’s After 7nm?
(Semiconductor Engineering - 14 Sep 2017)

Soitec Announces FD-SOI Pilot Line
(Compound Semiconductor - 14 Sep 2017)

TSMC Updates its Silicon Menu
(Electronic Engineering Times - 14 Sep 2017)

More than 45,000 expected at SEMICON Taiwan 2017
(Solid State Technology - 12 Sep 2017)

Fab equipment spending breaking industry records
(Solid State Technology - 12 Sep 2017)

KLA-Tencor Patterning Control Systems For Sub-7nm IC Manufacturing
(Silicon Semiconductor - 12 Sep 2017)

Manufacturing Bits: Sept. 12
(Semiconductor Engineering - 12 Sep 2017)

Systems Of Packages
(Semiconductor Engineering - 11 Sep 2017)

Survey: Optimism Grows for EUV
(Semiconductor Engineering - 11 Sep 2017)

How To Make Autonomous Vehicles Reliable
(Semiconductor Engineering - 11 Sep 2017)

Toshiba Plans Next Memory Fab
(Electronic Engineering Times - 08 Sep 2017)

Is The IoT Making Progress In Business?
(Semiconductor Engineering - 07 Sep 2017)

The Limits Of IP Reuse
(Semiconductor Engineering - 07 Sep 2017)

A Chip For All Seasons
(Semiconductor Engineering - 07 Sep 2017)

Stay ahead of the curve with SMC 2017 – Materials accelerating innovation
(Solid State Technology - 06 Sep 2017)

Securing talent to connect, collaborate and innovate
(Solid State Technology - 06 Sep 2017)

Manufacturing Bits: Sept. 5
(Semiconductor Engineering - 05 Sep 2017)

System Bits: Sept. 5
(Semiconductor Engineering - 05 Sep 2017)

Facebook Shows Smartphone AI, DNA Storage
(Electronic Engineering Times - 01 Sep 2017)

Waiting Game Could Strengthen Toshiba's Hand
(EE Times Blogs - 01 Sep 2017)

DARPA's ICECool Chills 3-D Stacks
(Electronic Engineering Times - 31 Aug 2017)

Executive Insight: Wally Rhines
(Semiconductor Engineering - 31 Aug 2017)

Siemens Doubles Down on Automotive Simulation
(Electronic Engineering Times - 31 Aug 2017)

Silicon solves problems for next-generation battery technology
(Solid State Technology - 30 Aug 2017)

Blog Review: Aug. 30
(Semiconductor Engineering - 30 Aug 2017)

Integrated Photonics
(Semiconductor Engineering - 30 Aug 2017)

Why Memory Prices Are Heating Up
(EE Times Blogs - 30 Aug 2017)

IBM Boosts Brain Understanding
(Electronic Engineering Times - 30 Aug 2017)

Technology Showcase finalists revealed for European MEMS & Sensors Summit
(Solid State Technology - Blog - 29 Aug 2017)

Lattice Weighs Seeking Trump’s Intervention on China Deal
(Bloomberg - 29 Aug 2017)

Fab Tool Sales Show Signs of Coming Back to Earth
(Electronic Engineering Times - 29 Aug 2017)

Brain Research Reimagines AI
(Electronic Engineering Times - 28 Aug 2017)

Samsung Verdict Jolts South Korea
(Electronic Engineering Times - 25 Aug 2017)

Next-generation drug testing on chips
(Solid State Technology - 25 Aug 2017)

IoT Must Escape Silos of Things
(EE Times Blogs - 25 Aug 2017)

Eclipse, Astronomers Descend on Small Town America
(EE Times Blogs - 25 Aug 2017)

One Belt, One Road
(Semiconductor Engineering - 24 Aug 2017)

The Semiconductor Industry’s Big Opportunity
(Semiconductor Engineering - 24 Aug 2017)

Executive Insight: Aart de Geus
(Semiconductor Engineering - 24 Aug 2017)

North American semiconductor equipment industry posts July 2017 billings
(Solid State Technology - Blog - 23 Aug 2017)

Stretchable metallic nanoclusters for wearable electronics
(Nanowerk - 23 Aug 2017)

The 200mm Equipment Scramble
(Semiconductor Engineering - 23 Aug 2017)

Manufacturing Bits: Aug. 22
(Semiconductor Engineering - 22 Aug 2017)

SEMI Foundation celebrates New York State United Teachers, Recognizes Applied Materials & KLA-Tencor Volunteers of the Year
(Solid State Technology - 21 Aug 2017)

‘Electronic skin’ takes wearable health monitors to the next level
(Solid State Technology - 21 Aug 2017)

WSTS Revises Chip Growth Forecast to 17%
(Electronic Engineering Times - 21 Aug 2017)

Key tech trends to track in the coming decade
(ComputerWorld Malaysia - 21 Aug 2017)

Four Foundries Back MRAM
(Semiconductor Engineering - 21 Aug 2017)

Flex Electronics Approach an Inflection
(EE Times Blogs - 18 Aug 2017)

EUV finally makes it
(Electronics Weekly - 18 Aug 2017)

Applied has record quarter; expects to beat it in Q4.
(Electronics Weekly - 18 Aug 2017)

DRAM Supply Improves Amid Record Sales
(Electronic Engineering Times - 18 Aug 2017)

Using Data To Improve Yield
(Semiconductor Engineering - 18 Aug 2017)

Why Fabs Worry About Tool Parts
(Semiconductor Engineering - 18 Aug 2017)

Report: Wearable Devices Market to Reach Over $150B Annually by 2027
(Printed Circuit Design & Fab Magazine - 17 Aug 2017)

Memory Market: More Than ASPs At Risk
(Semiconductor Engineering - 17 Aug 2017)

Building security into IoT devices: the new potential for security integration
(New Electronics - 16 Aug 2017)

Large wafers, complex IC designs among advanced packaging trends
(Solid State Technology - 15 Aug 2017)

DRAM, NAND Flash, Automotive Analog/Logic Among Best-Growing ICs
(Solid State Technology - 15 Aug 2017)

Vacuum subsystems: largest and fastest growing market segment
(Solid State Technology - Blog - 14 Aug 2017)

NAND Clash Spans Chip to Code
(Electronic Engineering Times - 14 Aug 2017)

Rudolph expands its presence in China for AMOLED display lithography
(Display Plus - 14 Aug 2017)

Osram Revs up Wuxi Plant with the 2nd Phase of Back-end Production Project
(LEDInside - 11 Aug 2017)

SEMI Europe Supports Call for Action on European Manufacturing Policy
(Press Release Point - 10 Aug 2017)

Samsung Promises 2018 Tbit NAND
(Electronic Engineering Times - 08 Aug 2017)

Engineer's Guide to Imaging Valley
(Electronic Engineering Times - 04 Aug 2017)

What is the status of III-N technology?
(Solid State Technology - 03 Aug 2017)

Latest Fab plans in China Will need government subsidies
(Evertiq - 03 Aug 2017)

Chip Sales Forecasts Continue to Rise
(Electronic Engineering Times - 03 Aug 2017)

Significant mid-year revision to 2017 IC market forecast
(Solid State Technology - 02 Aug 2017)

Kuala Lumpur debut for SEMICON Southeast Asia in 2018
(Solid State Technology - 01 Aug 2017)

Shanghai raises $7.4bn IC promotion fund
(Electronics Weekly - 01 Aug 2017)

Silicon wafer shortage starts in 2018
(Solid State Technology - 31 Jul 2017)

Universities obtain new funding from nano-bio manufacturing consortium
(Solid State Technology - 28 Jul 2017)

Second Quarter 2017 Silicon Wafer Shipments Increase Quarter-Over-Quarter; Continue to Ship at Record Levels
(EMS Now - 28 Jul 2017)

Semiconductor Equipment Sales Rise Again
(Electronic Engineering Times - 28 Jul 2017)

UMC Breaks into 14nm
(Electronic Engineering Times - 27 Jul 2017)

Brewer Science earns Perfect Quality Award from ON Semiconductor
(Solid State Technology - 27 Jul 2017)

Overcoming challenges in 3D NAND volume manufacturing
(Solid State Technology - 27 Jul 2017)

Foxconn selects Wisconsin for US location
(Evertiq - July 27, 2017)

Learning from Nature: Moth Eyes Inspire Nonreflective Screen Coating
(Scientific American - 26 Jul 2017)

Chips are a Fine European Alphabet Soup
(Bloomberg - 26 Jul 2017)

Color-shifting electronic skin could have wearable tech and prosthetic uses
(Nanowerk - 26 Jul 2017)

Second quarter 2017 silicon wafer shipments increase quarter-over-quarter
(Solid State Technology - Blog - 25 Jul 2017)

The road to fully flexible consumer electronics
(Electronic Products and Technology - 25 Jul 2017)

Power source problem solved for EUV
(New Electronics - 25 Jul 2017)

Flexible proximity sensor creates smart surfaces
(Nanowerk - 25 Jul 2017)

Report: Samsung Plans to Triple Foundry Market Share
(Electronic Engineering Times - 24 Jul 2017)

Taiwan is Largest Semiconductor Materials Market - as SEMICON Taiwan Approaches
(EMS Now - 20 Jul 2017)

Toward Smarter Manufacturing
(Semiconductor Engineering - 20 Jul 2017)

Filtering Out Fab Problems
(Semiconductor Engineering - 20 Jul 2017)

What Does An IoT Chip Look Like?
(Semiconductor Engineering - 19 Jul 2017)

U.S., China Sidestep Discord to Focus on More Balanced Trade (2)
(Washington Post - Bloomberg - 19 Jul 2017)

Record Chip Content in Electronics Projected
(Electronic Engineering Times - 19 Jul 2017)

Semiconductor Equipment Growth Stays Massive: 5 Stocks to Buy for Now and 2018
(Semiconductors - EIN News - 17 Jul 2017)

SEMICON: China, China, China
(Cadence - 17 Jul 2017)

What is Driving the Growth of the Semiconductor Glass Material Market?
(3DInCites - 14 Jul 2017)

Applied Materials announces 2017 Supplier of the Year Awards
(Solid State Technology - 14 Jul 2017)

200mm Fabs Thriving; SEMI’s Updated 200mm Fab Report Now Available
(EIN007: iconnect007 - 14 Jul 2017)

ASML Claims Major EUV Milestone
(Electronic Engineering Times - 14 Jul 2017)

Standards Industry Leaders Honored at SEMICON West 2017
(EIN007: iconnect007 - 13 Jul 2017)

Big data in autonomous driving
(Solid State Technology - 13 Jul 2017)

Day 3 of SEMICON West: Don’t Miss
(Solid State Technology - 13 Jul 2017)

James C. Morgan unveils Applied Wisdom
(Solid State Technology - 12 Jul 2017)

Day 2 of SEMICON West: Don’t Miss
(Solid State Technology - 12 Jul 2017)

China growth surge highlighted at SEMICON West
(Solid State Technology - Blog - 11 Jul 2017)

New programs reign at SEMICON West 2017
(Solid State Technology - 11 Jul 2017)

How low can we go?
(Solid State Technology - 11 Jul 2017)

Day 1 of SEMICON West 2017: Don’t Miss
(Solid State Technology - 11 Jul 2017)

Thought leaders address ‘Smart’ future at SEMICON
(Electronic Products and Technology - 11 Jul 2017)

SEMICON West preview: New “Meet the Experts” program
(Solid State Technology - 07 Jul 2017)

Funding China’s 200mm Fabs
(Semiconductor Engineering - 07 Jul 2017)

Samsung Plans $18 Billion of New Investments in Chip Production
(Bloomberg - 04 Jul 2017)

Who will win in 'Europe First' reboot?
(EE Times India: Electronics Design & Engineering - 04 Jul 2017)

Apple Tests 3-D Face Scanning to Unlock Next iPhone
(Bloomberg - 03 Jul 2017)

Wearable electronics: Superstretchable, supercompressible supercapacitors
(ScienceDaily - 03 Jul 2017)

Thought Leaders on the Semiconductor Industry's "Smart" Future - at SEMICON West 2017
(EMS Now - 03 Jul 2017)

Manufacturing Bits: July 3
(Semiconductor Engineering - 03 Jul 2017)

Verification In The Cloud
(Semiconductor Engineering - 29 Jun 2017)

DAC 54: From Grey to Colorful and Solutions-minded Messaging
(3DInCites - 29 Jun 2017)

Micron and SEMI partner to host High Tech U in Silicon Valley
(Solid State Technology - Blog - 28 Jun 2017)

SEMI and Solid State Technology announce 2017 “Best of West” Award finalists
(Solid State Technology - Blog - 28 Jun 2017)

Blog Review: June 28
(Semiconductor Engineering - 28 Jun 2017)

Saving the planet with flexible electronics
(Phys.org - 27 Jun 2017)

Purple-emitting LEDs Get Closer to the Sun
(Electronic Engineering Times - 26 Jun 2017)

Taiwan to Invest $131 Million in Semiconductor Industry
(Electronic Engineering Times - 22 Jun 2017)

Much Ado About China's Big IC Surge
(Electronic Engineering Times - 21 Jun 2017)

Award Winners Announced at 2017FLEX
(EMS Now - 21 Jun 2017)

Exploring Smart Sensor Explosive Growth at SEMICON West 2017
(TMCnet.com - 20 Jun 2017)

SEMI Europe applauds new semiconductor manufacturing investment
(Display Plus - 20 Jun 2017)

Bosch to Build $1.1 Billion Chip Plant for Self-Driving Cars
(Bloomberg - 19 Jun 2017)

MediaTek Chooses TSMC for 7nm
(Electronic Engineering Times - 16 Jun 2017)

North American semi equipment industry on the rise
(Evertiq - 16 Jun 2017)

Perfecting 200 mm processing tools
(Compound Semiconductor - 15 Jun 2017)

Globalfoundries unveils 7nm FinFET process
(New Electronics - 15 Jun 2017)

Europe's quantum bet
(Phys.org - 13 Jun 2017)

G’foundries Updates 7nm, EUV Plan
(Electronic Engineering Times - 13 Jun 2017)

Singapore’s manufacturing output beats expectations in April on higher production of electronics
(EMS Now - 13 Jun 2017)

Packaging can extend physical limits of semiconductors, says TSMC chair
(Digitimes - 12 Jun 2017)

TSMC 5nm chip production to take place in southern Taiwan
(Digitimes - 9 Jun 2017)

SEMICON West preview: Equipment components and subsystems
(Solid State Technology - Blog - 8 Jun 2017)

Forward Looking Data For Japan is Positive
(Bloomberg - 7 Jun 2017)

Korea Strategic Materials Conference a Huge Success
(Semiconductor Manufacturing & Design - 7 Jun 2017)

Supply chain needs paradigm shift in how to look at defect control
(Solid State Technology - 7 Jun 2017)

China May Become No. 2 Fab Spender by 2018
(Electronic Engineering Times - 7 Jun 2017)

SEMI reports record quarterly billings of $13.1B
(Solid State Technology - 6 Jun 2017)

Record fab spending for 2017 and 2018
(Solid State Technology - 6 Jun 2017)

Packaging can extend physical limits of semiconductors, says TSMC chair
(Digitimes - 12 Jun 2017)

TSMC 5nm chip production to take place in southern Taiwan
(Digitimes - 9 Jun 2017)

SEMICON West preview: Equipment components and subsystems
(Solid State Technology - Blog - 8 Jun 2017)

Forward Looking Data For Japan is Positive
(Bloomberg - 7 Jun 2017)

Korea Strategic Materials Conference a Huge Success
(Semiconductor Manufacturing & Design - 7 Jun 2017)

Supply chain needs paradigm shift in how to look at defect control
(Solid State Technology - 7 Jun 2017)

China May Become No. 2 Fab Spender by 2018
(Electronic Engineering Times - 7 Jun 2017)

SEMI reports record quarterly billings of $13.1B
(Solid State Technology - 6 Jun 2017)

Record fab spending for 2017 and 2018
(Solid State Technology - 6 Jun 2017)
 

TSMC orders equipment for NT$3 billion
(Digitimes - 6 Jun 2017)

Korea replaces Taiwan as largest semiconductor equipment market
(Digitimes - 6 Jun 2017)

IBM Research Alliance builds new transistor for 5nm technology »
(Silicon Semiconductor - 5 Jun 2017)

Big ideas are getting harder to find
(Phys.org - 5 Jun 2017)

SIA Welcomes DARPA Initiative to Advance Transformative Semiconductor Technologies
(EMS Now - 5 Jun 2017)

Foxconn says Apple, Amazon to join its bid for Toshiba chip business -Nikkei
(Business News & Financial News - Reuters - 5 Jun 2017)

TSMC to foray into next generation memory market, says report
(Digitimes - 5 Jun 2017)

New method of characterizing graphene
(Solid State Technology - Blog - 1 Jun 2017)

Nvidia CEO Says Moore’s Law Is Dead
(Electronic Engineering Times - 1 Jun 2017)

Volatility in electronic equipment supply chain
(Solid State Technology - 1 Jun 2017)

IFTLE 337 Will Samsung displace Intel in 2017?; Foundry Samsung – A reality; I-Cube
(Semiconductor Manufacturing & Design - 1 Jun 2017)

NextFlex Issues Third Call For Project Proposals Aimed At Bringing Flexible Hybrid Electronic Solutions To Market; More Than $45 Million Awarded In First Two Rounds
(PR Newswire - 1 Jun 2017)

Getting smart in manufacturing
(Computer World Singapore - 31 May 2017)

Chip Industry's 'Billion Dollar Capex Club' Expands
(Electronic Engineering Times - 31 May 2017)

Imec and Cascade Microtech develop first automatic probe system for advanced 3D chips
(Solid State Technology - Blog - 31 May 2017)

Researchers develop the first broadband image sensor array based on graphene-CMOS integration
(Phys.org - 30 May 2017)

TSMC to start equipment move-in at Nanjing plant in September
(Digitimes - 30 May 2017)

Graphene and quantum dots put in motion a CMOS-integrated camera that can see the invisible
(Nanotechnology Now - 29 May 2017)

Where is the semiconductor manufacturing Sweet Spot?
(Evertiq - 29 May 2017)

SEMICON West Drives SMART Automotive — Programs Reveal Road Ahead
(EMS Now - 26 May 2017)

MEMS & Sensors Industry Group Underpins Value in $80B MEMS & Sensors Ecosystem at Sensors Expo 2017
(PR Newswire - 25 May 2017)

NI's New CEO: Automotive To Be Key Opportunity
(Electronic Engineering Times - 24 May 2017)

Samsung Targets 4nm in 2020
(Electronic Engineering Times - 24 May 2017)

SEMICON West preview: MEMS
(Solid State Technology - Blog - 23 May 2017)

IEEE International Electron Devices Meeting announces 2017 Call for Papers
(Solid State Technology - 23 May 2017)

North American semiconductor equipment industry posts April 2017 billings
(Solid State Technology - 23 May 2017)

China Set to Rewrite FD-SOI History
(Electronic Engineering Times - 23 May 2017)

Technology partners at SEMICON West focus on innovations driving industry growth
(Solid State Technology - 22 May 2017)

China’s semiconductor industry and “win-win” growth
(Solid State Technology - Blog - 22 May 2017)

IFTLE 335 Catching Up on China and the Wait for the New Industry Driver
(Semiconductor Manufacturing & Design - 22 May 2017)

Zap! Graphene is bad news for bacteria
(Nanowerk - 22 May 2017)

4 Views of the Silicon Road Map
(Electronic Engineering Times - 19 May 2017)

Sensors detect disease markers in breath
(Phys.org - 18 May 2017)

Sensor/actuator sales take off »
(Silicon Semiconductor - 18 May 2017)

Technology Partners at SEMICON West Focus on Innovations Driving Industry Growth
(EMS Now - 18 May 2017)

Sensor Sales Finally Catch Fire
(Electronic Engineering Times - 17 May 2017)

Japan's financial industry embracing AI
(Nikkei Asian Review - 17 May 2017)

Conductive paper could enable future flexible electronics
(Phys.org - 17 May 2017)

First Quarter 2017 Silicon Wafer Shipments Increase Quarter-Over-Quarter; Continue to Ship at Record Levels
(EMS Now - 17 May 2017)

BTU Announces NextFlex in Silicon Valley as New Demo Site for the PYRAMAX Reflow Oven
(EMS Now - 17 May 2017)

Engaging diamond for next-era transistors
(Nanowerk - 16 May 2017)

2017FLEX Monterey focuses on accelerating to manufacturing as industry growth escalates
(Solid State Technology - 15 May 2017)

Progress in Short and Long Term Focus Areas for EUVL
(Semiconductor Manufacturing & Design - 15 May 2017)

Air Products to Supply JHICC's New Memory Fab in South China
(PR Newswire - 11 May 2017)

New “Thought Leadership Pass” Unlocks What’s Smart at SEMICON West 2017
(EMS Now - 11 May 2017)

New "Thought Leadership Pass" Unlocks What's Smart at SEMICON West 2017
(PR Newswire - 11 May 2017)

TSMC board approves US$1.27 billion for advanced technology capacity expansion
(Digitimes - 9 May 2017)

Quantum computing now closer to reality with new materials
(ScienceDaily - 9 May 2017)

UnitySC Receives Multiple Orders For Wafer Thinning Inspection Systems »
(Silicon Semiconductor - 9 May 2017)

Intel digs deep to keep Moore's Law alive
(PC World Australia - 9 May 2017)

Advanced Packaging Goes Mainstream
(Semiconductor Engineering - 8 May 2017)

Semiconductors as decal stickers
(Phys.org - 8 May 2017)

Intel Inside The Package
(Semiconductor Engineering - 8 May 2017)

The Future Of AI And Automation In The Workforce
(Forbes - 5 May 2017)

Brewer Science sells wafer-processing equipment business unit
(Semiconductor Today - 5 May 2017)

SMIC urges Taiwan chipmakers to partner with China-based peers
(Digitimes - 4 May 2017)

After Moore’s Law — What?
(EE Times Blogs - 4 May 2017)

Sensors, Sensors Everywhere
(Semiconductor Engineering - 4 May 2017)

'Wetting transparency' grows defect-free electronics
(EE Times India: Electronics Design & Engineering - 2 May 2017)

Flexible, organic and biodegradable: Stanford researchers develop new wave of electronics
(Solid State Technology - Blog - 2 May 2017)

Inside Lithography And Masks
(Semiconductor Engineering - 1 May 2017)

UMC to roll out 22nm process as early as 2018
(Digitimes - 27 Apr 2017)

Intel Boosts CapEx 20%
(Electronic Engineering Times - 27 Apr 2017)

Air Products Starts Up New Plant in Chongqing City for China's Leading LCD Panel Fab
(PR Newswire - 26 Apr 2017)

Scientists discover new atomically layered, thin magnet
(Phys.org - 26 Apr 2017)

MEMS & Sensors Technical Congress 2017: Knowing Your Unknowns
(Semiconductor Manufacturing & Design - 26 Apr 2017)

California bill would force utilities to give rebates for energy-storage systems
(Computerworld Blogs - 26 Apr 2017)

NextFlex Awards Contracts Totaling $45 Million To Date For Developing Flexible Hybrid Electronics Into A Commercially Viable U.S. Industry
(TMCnet.com - 26 Apr 2017)

Blog Review: April 26
(Semiconductor Engineering - 26 Apr 2017)

SEMICON Southeast Asia attendance surges on disruptive technology
(Solid State Technology - 25 Apr 2017)

Silicon wafer suppliers seeking long-term contracts
(Digitimes - 24 Apr 2017)

22nm Process War Begins
(Semiconductor Engineering - 24 Apr 2017)

3D-Printing of glass now possible
(Nanowerk - 21 Apr 2017)

Several China 12-inch fabs put construction on hold
(Digitimes - 20 Apr 2017)

The Evolution Of EUV
(Semiconductor Engineering - 20 Apr 2017)

Sizing up China’s Fab Tool Biz
(Semiconductor Engineering - 20 Apr 2017)

Moore’s Law: A Status Report
(Semiconductor Engineering - 20 Apr 2017)

SEMI Members Mobilize For 2017 SEMI Washington Forum
(Semiconductor Engineering - 20 Apr 2017)

Brewer Science earns GreenCircle Certification for zero waste to landfill for second consecutive year
(Solid State Technology - 19 Apr 2017)

Has Intel Invented a Universal Memory Tech?
(IEEE Spectrum - 19 Apr 2017)

Why Apple Is Developing Its Own Chips
(Bloomberg Tv - 19 Apr 2017)

Blog Review: April 19
(Semiconductor Engineering - 19 Apr 2017)

Connectivity will trigger IoT’s exponential growth
(EE Times India: Electronics Design & Engineering - 18 Apr 2017)

Smart Semi Fiber Does It All
(Electronic Engineering Times - 18 Apr 2017)

Manufacturing Bits: April 18
(Semiconductor Engineering - 18 Apr 2017)

Sibanye Gets U.S. Security Nod to Buy Stillwater Mines (2)
(Washington Post - Bloomberg - 17 Apr 2017)

Gartner, Worldwide Semiconductor Revenue will Increase in 2017 »
(Silicon Semiconductor - 17 Apr 2017)

The Hunt For A Low-Power PHY
(Semiconductor Engineering - 17 Apr 2017)

SEMI Reports 2016 Semiconductor Photomask Sales of $3.3 Billion
(EMS Now - 13 Apr 2017)

Japan struggles to keep Toshiba Memory domestically owned
(Nikkei Asian Review - 12 Apr 2017)

China fab toolmakers targeting advanced-node production
(Digitimes - 11 Apr 2017)

Combating counterfeit together
(New Electronics - 11 Apr 2017)

Apple is developing its own power management chips, says analyst
(InfoWorld - 11 Apr 2017)

Foreign competitors set up fabs in China
(Evertiq - 11 Apr 2017)

Apple and Google in the Memory Business?
(EE Times Blogs - 10 Apr 2017)

Money Talks in Toshiba Chip Fight
(Bloomberg - 10 Apr 2017)

SEMI reports 2016 semiconductor photomask sales of $3.3 billion
(Display Plus - 10 Apr 2017)

Time For New Rules
(Semiconductor Engineering - 10 Apr 2017)

Foundries Need Clear Benchmarks
(EE Times Blogs - 10 Apr 2017)

2016 marks year of recovery for global semiconductor market
(Solid State Technology - Blog - 7 Apr 2017)

Quantum transport goes ballistic
(Nanowerk - 5 Apr 2017)

China Market Access in Spotlight as First Trump-Xi Meeting Nears
(Bloomberg - 4 Apr 2017)

Korea's High-Tech Economy Threatened by Chinese Catch-up
(Bloomberg - 4 Apr 2017)

Trump Officials Alarmed Chinese May Bid for Westinghouse Unit
(Bloomberg - 4 Apr 2017)

Streamlining mass production of printable electronics
(Phys.org - 4 Apr 2017)

European semiconductor sales up 5.9% year-on-year
(Evertiq - 4 Apr 2017)

SEMI reports 2016 global semiconductor materials sales of $44.3 billion
(Evaluation Engineering - 3 Apr 2017)

Register for SEMICON West by April 7 for Best Pricing – SMART Starts Here
(EMS Now - 3 Apr 2017)

The Great Machine Learning Race
(Semiconductor Engineering - 3 Apr 2017)

IC Insights more than doubles its 2017 IC market growth forecast
(Solid State Technology - 30 Mar 2017)

Start-ups must be made to feel at ease to grow in Europe
(Science|Business - 30 Mar 2017)

Intel fellow calls for standardised density metric
(New Electronics - 29 Mar 2017)

Blog Review: March 29
(Semiconductor Engineering - 29 Mar 2017)

Why LED Is Lighting the Way for the IoT Revolution
(LEDInside - 28 Mar 2017)

Ultratech Receives Follow-On, Multiple System Orders From Asian OSATs
(LEDInside - 28 Mar 2017)

China devotes $22B to domestic chip industry expansion
(Computerworld - 28 Mar 2017)

Automotive market to benefit from Industry 4.0
(New Electronics - 28 Mar 2017)

NextFlex Awards Largest Set of Development Projects to Date
(Printed Electronics Now - 28 Mar 2017)

Patent Trolls Plague Chip Vendors
(Electronic Engineering Times - 28 Mar 2017)

Manufacturing Bits: March 28
(Semiconductor Engineering - 28 Mar 2017)

China's Largest Chipmaker Secures $22 Billion to Expand Globally
(Bloomberg - 27 Mar 2017)

Foreign robots dominate United States factory floors
(Evaluation Engineering - 27 Mar 2017)

MIT researchers set out to create self-assembling chips
(Information Technology World - 27 Mar 2017)

EUV lithography progress emphasized at SPIE Advanced Lithography
(Solid State Technology - Blog - 27 Mar 2017)

Imec to honor Samsung’s Dr. Kinam Kim with “Lifetime of Innovation Award”
(Solid State Technology - Blog - 27 Mar 2017)

ChipMOS Shanghai becomes JV between ChipMOS and Tsinghua Unigroup
(Digitimes - 27 Mar 2017)

China recruitment drive boosting semi salaries
(Electronics Weekly - 27 Mar 2017)

TSMC to start installing equipment at Nanjing fab in 2H17
(Digitimes - 23 Mar 2017)

When Will It Be Done?
(Semiconductor Engineering - 23 Mar 2017)

Intel Forms New AI Group Reporting Directly To CEO Brian Krzanich
(Forbes - 23 Mar 2017)

Roadmap Says CMOS Ends ~2024
(Electronic Engineering Times - 23 Mar 2017)

IBM, Tokyo Electron eye AI in chip manufacturing
(EE Times India: Electronics Design & Engineering - 23 Mar 2017)

Challenges Grow For IP Reuse
(Semiconductor Engineering - 23 Mar 2017)

Linde invests over EUR 110 million in China to strengthen position as supplier of choice for electronics manufacturers
(Blogs - Semiconductor Manufacturing & Design Community - 22 Mar 2017)

Blog Review: March 22
(Semiconductor Engineering - 22 Mar 2017)

Chipzilla Got Toppled
(Bloomberg - 21 Mar 2017)

Micron establishes its center of excellence for DRAM in Taiwan
(Display Plus - 21 Mar 2017)

N. American Semi Equipment Billings Up 64% in Feb.
(Printed Circuit Design & Fab Magazine - 21 Mar 2017)

5 reasons why China will rule tech, 2017 edition
(Computerworld - 21 Mar 2017)

SEMI headquarters relocates
(Solid State Technology - 20 Mar 2017)

Chinese M&A Scrutiny Helped Void Up to $75 Billion in Deals
(Bloomberg - 20 Mar 2017)

Further Thoughts from the 2017 SPIE AL EUV Lithography Conference
(Semiconductor Manufacturing & Design - 20 Mar 2017)

NASA Backs Startup Developing 'Smart' Color-Changing Air Filters
(PR Newswire - 20 Mar 2017)

IBM researchers prove it’s possible to store data on a single atom
(Electronic Products Magazine - 20 Mar 2017)

Star-spangled find may lead to advanced electronics
(Nanowerk - 20 Mar 2017)

Patterning Problems Pile Up
(Semiconductor Engineering - 20 Mar 2017)

TSMC Tips 7+, 12, 22nm Nodes
(Electronic Engineering Times - 16 Mar 2017)

SEMI Reports 2016 Global Semiconductor Equipment Sales of $41.2 Billion
(EMS Now - 16 Mar 2017)

ASML strikes deal with China equipment maker
(Digitimes - 16 Mar 2017)

SEMI Leads Smart Manufacturing Evolution
(EMS Now - 15 Mar 2017)

SEMI reports 2016 global semiconductor equipment sales of $41.2B
(Solid State Technology - Blog - 14 Mar 2017)

DoD Task Force Says No to Trusted Foundry
(Printed Circuit Design & Fab Magazine - 13 Mar 2017)

Intel races ahead in autonomous cars with $15.3 billion Mobileye buy
(PC World Australia - 13 Mar 2017)

Entegris Partners with China's Spectrum Materials to Manufacture Entegris Specialty Chemicals in China
(PR Newswire - 13 Mar 2017)

InvenSense and GLOBALFOUNDRIES Collaborate on Industry-Leading Ultrasonic Fingerprint Imaging Technology
(Press Release Point - 9 Mar 2017)

Worst-Case Results Causing Problems
(Semiconductor Engineering - 9 Mar 2017)

Blog Review: March 8
(Semiconductor Engineering - 8 Mar 2017)

The Case For Narrowband-IoT
(Semiconductor Engineering - 8 Mar 2017)

Record spending for fab equipment expected in 2017 and 2018
(Solid State Technology - Blog - 7 Mar 2017)

Record Spending for Fab Equipment Expected in 2017 and 2018
(TMCnet.com - 7 Mar 2017)

Intel Announces the 2016 Supplier Continuous Quality Improvement Awards
(Press Release Point - 6 Mar 2017)

Sweat patch mops up real-time performance monitor
(Solid State Technology - Blog - 6 Mar 2017)

Semiconductor manufacturing’s next big thing at ASMC 2017
(Solid State Technology - 2 Mar 2017)

[2017FLEX Japan] Japan’s first flexible hybrid electronics conference will be held on April 11 - 12
(Display Plus - 1 Mar 2017)

SEMICON Southeast Asia 2017 World of IoT: Futura-X showcase
(Display Plus - 1 Mar 2017)

ASML Revs EUV Engines
(Electronic Engineering Times - 1 Mar 2017)

NextFlex Honors Several Dedicated Individuals Contributing to FHE Industry
(Printed Electronics Now - 1 Mar 2017)

What Does An AI Chip Look Like?
(Semiconductor Engineering - 1 Mar 2017)

SEMICON China Set for China's Booming Semiconductor Manufacturing
(EMS Now - 28 Feb 2017)

Lattice Shareholders Approve China Takeover
(Electronic Engineering Times - 28 Feb 2017)

IoT to shake up manufacturing sector
(Solid State Technology - Blog - 27 Feb 2017)

Expand Connections and Opportunities at LED Taiwan 2017
(EMS Now - 24 Feb 2017)

KLA-Tencor introduces new metrology systems
(Solid State Technology - 23 Feb 2017)

Foxconn may seek majority stake in Toshiba's memory ops
(Nikkei Asian Review - 23 Feb 2017)

Applied Materials rides high on China's chip, panel ambitions
(Nikkei Asian Review - 22 Feb 2017)

SEMI posts North American equipment industry billings (Evaluation Engineering - 22 Feb 2017)

Big Changes In Patterning (Semiconductor Engineering - 22 Feb 2017)

MEMS: A Tale Of Two Tough Markets (Semiconductor Engineering - 22 Feb 2017)

SEMI appoints Ajit Manocha as President and CEO (Solid State Technology - Blog - 21 Feb 2017)

SEMI Appoints Ajit Manocha as President and CEO (PR Newswire (EN) - 21 Feb 2017)

Manufacturing Bits: Feb. 21 (Semiconductor Engineering - 21 Feb 2017)

Intel Continues to Drive Semiconductor Industry R&D Spending (EMS Now - 20 Feb 2017)

Semiconductor Process Development: Finding A Faster Way To Profitability (Semiconductor Engineering - 20 Feb 2017)

Get Ready For Nanotube RAM (Semiconductor Engineering - 20 Feb 2017)

Applied Materials says that we're just at the beginning of the OLED adoption cycle (OLED Info - 19 Feb 2017)

Vital Control in Fab Materials Supply-Chains – Part 2 (Blogs - Semiconductor Manufacturing & Design Community - 16 Feb 2017)

Breakthrough in 'wonder' materials paves way for flexible tech (Phys.org - 16 Feb 2017)

China Moves To Top Spot In Fab Equipment Spending (Semiconductor Engineering - 16 Feb 2017)

Progress In Flexible Electronics (Semiconductor Engineering - 16 Feb 2017)

Battling Fab Cycle Times (Semiconductor Engineering - 15 Feb 2017)

3D and 2.5D IC packaging market expected to be worth $170B by 2022 (Solid State Technology - Blog - 14 Feb 2017)

NextFlex Announces Next Set of Projects (Printed Electronics Now - 14 Feb 2017)

Winners & Losers of GloFo's China Deal (EE Times Blogs - 13 Feb 2017)

GlobalFoundries 12-inch wafer production line in Chengdu commences operation (Solid State Technology - Blog - 13 Feb 2017)

TSMC Says Impact from Quake Not Material (Electronic Engineering Times - 13 Feb 2017)

How China's Dealmakers Pulled Off a $207 Billion Global Spree
(Bloomberg - 13 Feb 2017)

Intel $7 Billion Investment in Next-Gen Semiconductor Factory »
(Silicon Semiconductor - 13 Feb 2017)

GLOBALFOUNDRIES Expands to Meet Worldwide Customer Demand: Company invests for capacity growth in the United States, Germany, China and Singapore
(Nanotechnology Now - 10 Feb 2017)

The Week In Review: Manufacturing
(Semiconductor Engineering - 10 Feb 2017)

Intel announces $7B investment in next-gen semiconductor fab in Arizona
(Solid State Technology - 9 Feb 2017)

Fix Processes, Then Silos
(Semiconductor Engineering - 9 Feb 2017)

Toshiba starts construction of Fab 6 and Memory R&D Centre
(New Electronics - 9 Feb 2017)

SEMICON Korea huge 30th year anniversary event opens today
(Solid State Technology - 8 Feb 2017)

An oxide semiconductor just single atom thick
(Nanowerk - 8 Feb 2017)

Addressing Test Time Challenges
(Semiconductor Engineering - 8 Feb 2017)

Annual silicon volume shipments remain at record highs
(Solid State Technology - Blog - 7 Feb 2017)

Advantest Will Showcase Products, Demonstrations and a Technical Paper at SEMICON Korea, February 8-10 in Seoul
(Digitimes - 7 Feb 2017)

How Germany Hammers Down Renewable Energy Costs: QuickTake Q&A
(Bloomberg - 7 Feb 2017)

SK Hynix Makes Bid to Buy Part of Toshiba’s Memory Chip Arm
(Bloomberg - 7 Feb 2017)

Betting On Wafer-Level Fan-Outs
(Semiconductor Engineering - 6 Feb 2017)

Chip-Package-Board Issues Grow
(Semiconductor Engineering - 6 Feb 2017)

Uncovering Unintended Behavior
(Semiconductor Engineering - 3 Feb 2017)

Friday Quiz: Acquired Companies, Part 3
(EE Times Blogs - 2 Feb 2017)

Global semiconductor sales reach $339 billion in 2016
(Display Plus - 2 Feb 2017)

Work Remains To Enable Connected Cars, Automotive Security
(Semiconductor Engineering - 2 Feb 2017)

Q'comm-NXP Faces Trump, China Hurdles
(Electronic Engineering Times - 2 Feb 2017)

“Escape Room” Game Challenges Physics-Phobes to Face Their Fear
(Scientific American - 2 Feb 2017)

Samsung could set up a plant in US to manufacture home appliances – report
(International Business Times UK - 2 Feb 2017)

Thin, flexible, light-absorbent material for energy and stealth applications
(Nanowerk - 2 Feb 2017)

Gartner Says Samsung and Apple Continued to Lead as Top Global Semiconductor Customers in 2016
(EMS Now - 1 Feb 2017)

Without technology, China's "MIC 225" results for ICs likely to fall woefully short of its goals
(Display Plus - 1 Feb 2017)

Rethinking Stats In Manufacturing Equipment
(Semiconductor Engineering - 1 Feb 2017)

FlexTech announces contract for battery development with ITN Energy Systems
(Solid State Technology - Blog - 31 Jan 2017)

Our Man in China: Ask Yorbe
(EE Times Blogs - 30 Jan 2017)

[SEMICON Korea 2017] Air Products expand nitrogen capacity in Korea’s Pyeongtaek City to support increasing demand of semiconductor industr
(Display Plus - 30 Jan 2017)

New 'made in China' chip on the way as country boosts indigenous tech
(ComputerWorld Malaysia - 30 Jan 2017)

Managing Parasitics For Transistor Performance
(Semiconductor Engineering - 30 Jan 2017)

STMicroelectronics Showcases its Latest Solutions for Smart Driving »
(Silicon Semiconductor - 30 Jan 2017)

Car electrification calls for more standardization, says Silicon Mobility
(EETE Automotive - 27 Jan 2017)

Trump, Brexit Cloud Upbeat 2017
(Electronic Engineering Times - 26 Jan 2017)

Bidding War On H-1B Visas?
(Semiconductor Engineering - 26 Jan 2017)

Foxconn's U.S. Plan Doesn't Add Up
(Bloomberg - 23 Jan 2017)

STATS ChipPAC recognized for patent innovations for the seventh consecutive year by IEEE
(Solid State Technology - Blog - 23 Jan 2017)

Deals Dominate Semiconductors
(Mannerisms - Electronics Weekly Blog - 23 Jan 2017)

X-Fab is Fastest Growing Foundry
(Electronic Engineering Times - 23 Jan 2017)

China responds to US chip threats with a USD 30 bn factory
(Computer World Singapore - 23 Jan 2017)

Why Every Company Is A Technology Company
(Forbes - 23 Jan 2017)

Semiconductor M&A reach peak in 2015-2016, says IC Insights
(Digitimes - 20 Jan 2017)

Tsinghua to Build $30 Billion Memory Fab in China
(Electronic Engineering Times - 19 Jan 2017)

What’s Up MEMS?
(Semiconductor Engineering - 19 Jan 2017)

China Factors Heavily In Policy And Business Considerations
(Semiconductor Engineering - 19 Jan 2017)

5 Takeaways From ISS
(Semiconductor Engineering - 19 Jan 2017)

China Unveils Memory Plans
(Semiconductor Engineering - 19 Jan 2017)

Chip Sales Grew 1.5% in ‘16, Gartner says
(Electronic Engineering Times - 18 Jan 2017)

Future of Chip Research Group Questioned
(Electronic Engineering Times - 18 Jan 2017)

Blog Review: Jan. 18
(Semiconductor Engineering - 18 Jan 2017)

Extending the era of Moore’s Law through lower cost patterning »
(Silicon Semiconductor - 17 Jan 2017)

CEOs Rush to Avoid Trump’s Wrath With Stops at the Gilded Tower
(Bloomberg - 17 Jan 2017)

What Can Go Wrong In Automotive
(Semiconductor Engineering - 17 Jan 2017)

Manufacturing Bits: Jan. 17
(Semiconductor Engineering - 17 Jan 2017)

Commentary: A lesson to be learned from China panel industry headhunting
(Digitimes - 16 Jan 2017)

Outlook for 450 mm wafers fades »
(Silicon Semiconductor - 13 Jan 2017)

Fab investment surging in China, says SEMI
(Digitimes - 13 Jan 2017)

TSMC could build plant in the US, says Chang
(Digitimes - 12 Jan 2017)

SEMI ISS 2017 uncovers new growth, forecast upgrades
(Display Plus - 12 Jan 2017)

EDA in the year 2017 – Part 1
(Chip Design Blogs - 12 Jan 2017)

China Defends Big Chip Bet
(Electronic Engineering Times - 12 Jan 2017)

TSMC Expects Flat Year for Foundry
(Electronic Engineering Times - 11 Jan 2017)

China Expected to Poach More Taiwan Chip Execs
(Electronic Engineering Times - 11 Jan 2017)

SEMI ISS 2017 uncovers new growth, forecast upgrades
(Solid State Technology - Blog - 10 Jan 2017)

Semiconductor eyed for next-generation 'power electronics'
(Phys.org - 10 Jan 2017)

Manufacturing Bits: Jan. 10
(Semiconductor Engineering - 10 Jan 2017)

Blog Review: Jan. 4
(Semiconductor Engineering - 4 Jan 2017)

BRIEF-TSMC orders machinery equipment from Lam Research, Applied Materials
(Business News & Financial News - Reuters - 3 Jan 2017)

Printed Electronics Now’s Top 10 Online Exclusives for 2016
(Printed Electronics Now - 3 Jan 2017)

Chip Sales Grew Sharply in November
(Electronic Engineering Times - 3 Jan 2017)

Bloomberg’s Srinivasan: Move From China Could Harm Chip Makers
(Bloomberg - 3 Jan 2017)

TSMC 7nm ready for customer tape-outs in 2Q17, says report
(Digitimes - 3 Jan 2017)

Yangtze River Storage breaks ground for memory plant
(Digitimes - 2 Jan 2017)

Obama to Urge Protection for Chip Industry
(Electronic Engineering Times - 2 Jan 2017)

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