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The ASMC Committee is composed of industry professionals representing the microelectronics supply-chain. Abstracts are peer-reviewed by members of ASMC technical committee with the goal of developing a high quality, informative conference. All abstracts will be evaluated on the strength of the abstract submitted, including content matter and relevance to semiconductor manufacturing. If your abstract is accepted, your paper MUST be presented in person. Submission of an abstract to ASMC represents a commitment to present a non-commercial, peer-reviewed paper at the conference. ALL technical manuscripts, regardless of presentation format, will be published in the ASMC 2018 proceedings. Authors who missed the call for papers should consider submitting an abstract in the 'Breaking News' category.
We strongly recommend that authors receive management approval, including travel support, in advance of abstract submission. If you cannot confirm that your paper will be presented in person, either by yourself, co-author or qualified speaker, your paper will not be published. ASMC 2018 will be held in Saratoga Springs, New York, USA. If you travel to ASMC from outside the United States, you may require a visa. Please begin the process early! If you require a letter of invitation for to obtain a travel visa to the U.S., please contact email@example.com
It is critical that you include in your timeline company approval cycles, which may be a longer process than preparation of the actual manuscript and presentation. Please note the following dates and share this information with your co-author(s) and management. Conference registration is a requirement for participation. Dates are subject to change.
Congratulations to the
2017 Best Paper Award Sponsored by Entegris
Chasing Ghosts: How an SRAM Detected the Subtle Impact of Stray Light
Stephen Lucarini, Bachir Dirahoui, Richard Hafer, Weihao Weng, Laura Safran, Sweta Pendyala, Karl Barth, Timothy Brunner, Zhigang Song, Brett Engel, David Clark, Keliang He, Cathy Gow, Anne Friedman, GLOBALFOUNDRIES
2017 Best Student Paper Award Sponsored by GLOBALFOUNDRIES
Enhanced Voltage Silicon NFET-MESFET Cascode Amplifiers Integrated on a 45nm SOI CMOS Technology for RFIC Applications
Payam H. Mehr, W. Lepkowski, S. Moallemi, J. Kitchen and T. J. Thornton, Arizona State University
Important Due Dates and Instructions
|Call for Papers Opens||20 July 2017||Authors must use the abstract template and upload to the ASMC collection site. Please indicate if the abstract is to be considered for a poster presentation or the ASMC student best paper competition.|
|Abstracts Due (extended)||18 October 2017||Abstracts submitted after the published deadline will be considered on a case-by-case basis. Abstracts should be uploaded to the ASMC 2018 Collection Site|
|Author Notification Sent||6 December 2017||Primary authors/contacts will receive an instructional email. Upon notification, authors will be requested to confirm their participation in the conference.|
|Speaker Agreement||20 December 2017||Speaker agreement and confirmation are due. Authors should have management, financial/travel support and any necessary IP approval. Send to firstname.lastname@example.org.|
|Manuscript||5 February 2018 ||ALL authors, regardless of session, are required to submit a manuscript using the approved MANUSCRIPT TEMPLATE. This is the same template used for the extended abstract. Accepted formats to submit are: doc, .docx, pdf. The manuscript must be uploaded to the ASMC collection site no later than 5 February. Special PDF generation and checking capability will be provided for submission after review and approval by committee. Only changes requested by reviewers should be made after this submission date. *Additional instructions below.|
28 February 2018
Feedback from committee reviewers, with requested edits/changes for author(s) to be included in final manuscript.
|Registration||19 March 2018||Early registration ends. To receive speaker discount, use one of following campaign codes:|
ASMCSPKRMBR (SEMI member); ASMCSPKR (IEEE, or non-SEMI member). For student code, please contact email@example.com
|Final Manuscript||2 April 2018||Final, company-approved manuscript (PDF) and must be submitted electronically to the ASMC collection site in order to be published in the ASMC 2018 proceedings. IEEE PDF eXpress opens 28 February: http://www.pdf-express.org. Conference ID TBA.|
|Presentations Due||23 April 2018|
|Conference Dates||April 30-May 3, 2018||Hilton Hotel/City Center, Saratoga Springs, New York. All ASMC 2018 speakers/presenters who attend the conference must register. A reduced speaker registration rate is available. Contact firstname.lastname@example.org for information.|
All authors are required to submit a preliminary manuscript (PDF or DOC) to the ASMC collection site. This manuscript should reflect the complete/final manuscript, e.g. contain at least 90%-100% of content. Final manuscript only must be processed through IEEE PDF eXpress. The initial manuscript does not need to be processed through IEEE PDF eXpress
Final, company-approved manuscripts, follow these steps (after receiving final input from reviewers):
Maximum number of pages is six (6). Authors will be provided feedback to ensure the highest technical quality of manuscripts. If you have misplaced your ID and password, please contact email@example.com.